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| Preliminary Technical Data FEATURES Tiny 3.35 mm x 2.50 mm x 0.88 mm surface-mount package High SNR of 62 dBA High sensitivity of -38 dBV Flat frequency response from 100 Hz to 15 kHz Low current consumption: <250 A Single-ended analog output High PSRR of 70 dB Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant Omnidirectional Microphone with Bottom Port and Analog Output ADMP404 GENERAL DESCRIPTION The ADMP404 is a high quality, low cost, low power, analog output bottom-ported omnidirectional MEMS microphone. The ADMP404 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The ADMP404 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP404 has a high SNR and flat, wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. A built-in particle filter provides high reliability. The ADMP404 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. The ADMP404 is available in an ultraminiature 3.35 mm x 2.50 mm x 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP404 is halide free. APPLICATIONS Smartphones and feature phones Digital video cameras Bluetooth headsets Video phones Teleconferencing systems FUNCTIONAL BLOCK DIAGRAM ASIC MEMS VDD OUTPUT ADMP404 MEMBRANE BACKPLATE IMPEDANCE CONVERTER OUTPUT AMPLIFIER Figure 1. Rev. PrH Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2010 Analog Devices, Inc. All rights reserved. 08616-001 GND ADMP404 TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Absolute Maximum Ratings............................................................ 4 ESD Caution .................................................................................. 4 Pin Configuration and Function Descriptions ............................. 5 Typical Performance Characteristics ............................................. 6 Applications Information ................................................................ 7 Preliminary Technical Data Connecting the ADMP404 to a Codec .......................................7 Connecting the ADMP404 to an Op Amp Gain Stage .............7 PCB Land Pattern Layout .................................................................8 Handling Instructions .......................................................................9 Pick and Place Equipment ...........................................................9 Reflow Solder .................................................................................9 Board Wash ....................................................................................9 Reliability Specifications ................................................................ 10 Outline Dimensions ........................................................................11 Ordering Guide ...........................................................................11 REVISION HISTORY Rev. PrH | Page 2 of 12 Preliminary Technical Data SPECIFICATIONS ADMP404 TA = 25C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Frequency Response 1 Symbol Test Conditions/Comments Min Typ Omni -38 62 32 100 15 Max Unit 1 kHz, 94 dB SPL SNR EIN Low frequency -3 dB point High frequency -3 dB point Deviation from flat response within pass band 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak -41 -35 -3 70 120 1.5 Total Harmonic Distortion Power Supply Rejection Ratio Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output impedance Output DC Offset Output Current Limit Polarity 1 2 THD PSRR +2 3 dBV dBA dBA SPL Hz kHz dB % dB dB SPL VDD IS ZOUT 3.6 250 200 0.8 90 Noninverting2 V A V A See Figure 4 and Figure 6. Positive going (increasing) pressure on the membrane results in a positive going (increasing) output voltage. Rev. PrH | Page 3 of 12 ADMP404 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Rating 3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B -40C to +70C Preliminary Technical Data Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION TP RAMP-UP tP CRITICAL ZONE TL TO TP TEMPERATURE TL TSMAX TSMIN tL tS PREHEAT RAMP-DOWN t25C TO PEAK TIME Figure 2. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25C (t25C) to Peak Temperature Sn63/Pb37 3C/sec max 100C 150C 60 sec to 120 sec 3C/sec 60 sec to 150 sec 183C 240C + 0C/-5C 10 sec to 30 sec 6C/sec max 6 minute max Pb-Free 3C/sec max 150C 200C 60 sec to 120 sec 3C/sec 60 sec to 150 sec 217C 260C + 0C/-5C 20 sec to 40 sec 6C/sec max 8 minute max Rev. PrH | Page 4 of 12 08616-002 Preliminary Technical Data PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND 2 1 ADMP404 OUTPUT 3 ADMP404 VDD 08616-003 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 3. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 3 Mnemonic OUTPUT GND VDD Description Analog Output Signal. Ground. Power Supply. Rev. PrH | Page 5 of 12 ADMP404 TYPICAL PERFORMANCE CHARACTERISTICS 10 8 6 10 Preliminary Technical Data SENSITIVITY (dB) 4 2 0 -2 -4 -6 -8 08616-009 0 (dB) -10 -20 100 100 1k FREQUENCY (Hz) 10k 1k FREQUENCY (Hz) 10k Figure 4. Frequency Response Mask 0 -10 -20 -30 -40 -50 -60 -70 -80 100 Figure 6. Typical Frequency Response (Measured) PSRR (dB) 1k FREQUENCY (Hz) 10k Figure 5. Typical Power Supply Rejection Ratio vs. Frequency Rev. PrH | Page 6 of 12 08616-005 08616-010 -10 Preliminary Technical Data APPLICATIONS INFORMATION The ADMP404 output can be connected to a dedicated codec microphone input (see Figure 7) or to a high input impedance gain stage (see Figure 8). A 0.1 F ceramic capacitor (C1) at VDD placed close to the ADMP404 supply pins is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A 1 F or larger dc-blocking tantalum capacitor (C2) is required at the output of the microphone. ADMP404 CONNECTING THE ADMP404 TO AN OP AMP GAIN STAGE C1 0.1F VDD GND OUTPUT C2 1F 3 R1 10k U1 + 7 6 CONNECTING THE ADMP404 TO A CODEC C1 0.1F VDD GND C2 1F ADMP404 GND OP177 2 4 GAIN = (R2 + R3)/R3 R3 R2 08616-021 ADAU1761 GND OUTPUT + + Figure 8. ADMP404 Connected to the OP177 Op Amp MIC INPUT 08616-020 ADMP404 GND GND Figure 7. ADMP404 Connected to the Analog Devices ADAU1761 Codec Rev. PrH | Page 7 of 12 ADMP404 PCB LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP404 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 9. Care should be taken to avoid applying solder paste to the sound hole in the PCB. A suggested Preliminary Technical Data solder paste stencil pattern layout is shown in Figure 10. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. 1.52 0.68 1.22 O1.55 1.90 O0.95 0.61 0.61 0.90 Figure 9. PCB Land Pattern Layout 1.55/1.05 DIA. 0.225 CUT WIDTH (2x) 0.8 x 0.6 2x 1.22 0.2 x 45 TYP 1.52mm Figure 10. Suggested Solder Paste Stencil Pattern Layout Rev. PrH | Page 8 of 12 08616-008 08616-007 Preliminary Technical Data HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Care should be taken to avoid damage to the MEMS microphone structure as follows: * Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 20 kg are experienced because such events may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. ADMP404 REFLOW SOLDER For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. * * * Rev. PrH | Page 9 of 12 ADMP404 RELIABILITY SPECIFICATIONS Preliminary Technical Data The microphone sensitivity after stress must deviate by no more than 3 dB from the initial value. Table 5. Stress Test Low Temperature Operating Life High Temperature Operating Life THB Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Description -40C, 500 hours, powered +125C, 500 hours, powered +65C/85% relative humidity (RH), 500 hours, powered -40C/+125C, one cycle per hours, 100 cycles +150C, 500 hours -40C, 500 hours All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV Rev. PrH | Page 10 of 12 Preliminary Technical Data OUTLINE DIMENSIONS 3.06 REF 3.425 3.350 3.275 0.75 REF 1.52 1.08 0.30 BSC 1 ADMP404 REFERENCE CORNER 0.30 BSC 0.90 x 0.68 (PINS 1, 3) 0.54 REF 2 0.25 NOM DIA. 0.20 MIN THRU HOLE 1.56 DIA. 0.95 DIA. (SOUND PORT) 2.575 2.500 2.425 2.21 REF 1.22 BSC 1.25 3 TOP VIEW 0.98 0.88 0.78 SIDE VIEW 0.65 REF 0.64 REF 0.20 TYP x 45 BOTTOM VIEW 0.21 REF Figure 11. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.35 mm x 2.50 mm Body (CE-3-2) Dimensions shown in millimeters ORDERING GUIDE Model1 ADMP404ACEZ ADMP404ACEZ-RL ADMP404ACEZ-RL7 EVAL-ADMP404Z 1 2 Temperature Range -40C to +70C -40C to +70C -40C to +70C Package Description 3-Terminal LGA_CAV 3-Terminal LGA_CAV, 13" Tape and Reel 3-Terminal LGA_CAV, 7" Tape and Reel Evaluation Board Package Option CE-3-22 CE-3-22 CE-3-22 Ordering Quantity 1 10,000 1,000 Z = RoHS Compliant Part. This package option is halide free. Rev. PrH | Page 11 of 12 03-12-2010-A ADMP404 NOTES Preliminary Technical Data (c)2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR09027-0-4/10(PrH) Rev. PrH | Page 12 of 12 |
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